Subtractive & Mold Applications
- Deep etching of silicon, such as Bosch Process, glass and polymers
- Embossing mold for silicone imprints
Additive Applications
- High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR26-12000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR26-12000P

Applications
- Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm².
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line

Applications
- Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
- Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.

Spin-On Glass Coatings

Spin-On glass
Coating IC1-200 DC4-500	Thickness 0.17µm - 0.50µm 0.45µm - 1.0µm

Applications

Smoothing layer as a part of dielectric in multilevel metal process
Protective coating
Intermediate coating in trilayer resist process

Properties

Compatible with spin coating techniques
Shelf-life exceeding 3 years at room temperature
Good adhesion to polymers
Lack of solubility in common solvents after curing at temperatures lower than 100°C
Compatible with typical resist coating equipment and no need for SOG coaters

Impact on productivity

Elimination of CVD SiO2 in some applications
Elimination of time consuming deposition and etchback of SiO2 to fill narrow tranches in multilevel metal process
Elimination of polishing in preparation of substrates for thin film magnetic head fabrication