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  • Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR26-12000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR26-12000P


  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line


  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.


Light-Emitting Diodes [LEDs]

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For the past decade, Futurrex has been supplying most of the world’s top LED and HBLED manufacturers with enabling chemistries allowing customers to create cutting edge products and form factors with differentiated performance at continuously declining cost per device. Futurrex not only provides novel chemistries and processes, but these suites of products give customers truly turnkey solutions from front-of-the line processing to packaging.

In manufacturing leading-edge LED & HBLED products customers can choose from any of the following Futurrex product lines:

  • NR9-PY series for lift-off applications.
  • NR7-P series for mask applications in dry etching.
  • IC1-series for smoothing dielectric coatings and phosphor binding applications.
  • RD6-series resist developer for quick resist development, universally compatible with the development of positive or negative resists.
  • RR41-series for efficient and unique characteristics and performance during resist removal, including the safe removal of various temporary coatings, while being 100% compatable with Si, III/V substrates, II/VI substrates, Indium Tin Oxide (ITO) and all conventional metals including Cu, Ti, TiW, Au, Pt, Al, Ni, Ag-alloys, etc.
  • EBR2-series for efficient and quick edge bead removing applications.

Futurrex also enables the manufacturing and intellectual property of Organic LEDs (OLEDS):
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