• Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR26-12000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR26-12000P

  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line

  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
Photoresist Thickness = 3µm.

Solar PV

Futurrex offers unique, cost-curve shifting solutions for companies developing solar-related technologies. Our novel products take existing, long-standing processes centered around wet chemistry processing, and apply these techniques to enhancing solar products, shifting cost- curves by orders of magnitude, while increasing throughput and efficiency goals across a spectrum of solar technologies.

For crystalline and amorphous silicon technologies, Futurrex provides spin-on dopants that replace traditional, capital-equipment intensive ion implant applications with low-cost, traditional wet-chemistry processing.

We provide both P and B-based dopant solutions that allow customers quick product development cycles at minute capital cost vs. current technologies, enabling them to reach cost per watt and grid parity goals more quickly.

Such products include:

Futurrex has been supplying III/V solar customers including private companies and government entities for the past decade. For III/V PV applications, we offer the following suite of products:

  • NR7/NR9-PY-series resists for lift-off applications
  • NR9-P series resists for general patterning applications where advanced adhesion is required

For newer thin-film technologies (CdTe, CIGS) that utilize lithography steps, Futurrex offers the following products that can be used in conjunction with physical vapor deposition or roll-to-roll deposition technologies: