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  • Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR26-12000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR26-12000P


  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line


  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.


Microfluidics & Biochips

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Futurrex provides solutions for medical device, genetic testing, microchannel cooling and sensor companies which require low-cost processing techniques to create microscopic channels for gradual or mass fluidic diffusion and sampling.

Our solutions allow a customer to create microchannels by additive, subtractive or embossing techniques.

OEMs in the biochip, diagnostic, sensors and micro-cooling spaces utilize various Futurrex products to meet their processing goals:

  • NR7-P series negative resists for mask applications in dry etching into glass, plastics or a variety of other substrates.
  • NR26-series negative resists for plating high-aspect ratio patterns.
  • NR5-series negative resists for embossing microchannels
  • RD6 series resist developer for quick resist development, universally compatible with the development of positive or negative resists.
  • RR41/RR5 series chemicals for efficient and unique characteristics and performance during resist removal, including the safe removal of various temporary coatings, while being 100% compatible with Si, III/V substrates, II/VI substrates, Indium Tin Oxide (ITO) and all conventional metals including Cu, Ti, TiW, Au, Pt, Al, Ni, Ag-alloys, etc.
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