Negative Etch Resists

Negative Resists - Etch Masking

RIE/Ion Milling High Temperature Resists
Resist NR7-250P NR7-1000P NR7-1500P NR7-3000P NR7-6000P NR5-8000	Thickness 0.2µm - 0.6µm 0.7µm - 2.1µm 1.1µm - 3.1µm 2.1µm - 6.3µm 5.0µm - 12.2µm 5.8µm - 100µm
Temperature resistance = 150°C. Selectivities of Futurrex NR5 & NR7 resists in RIE outperform commercial positive-tone resists by 25-33% under certain conditions. At processing temperatures < 120°C, NR5 and NR7 series resists are strippable at 25°C.

Wet Etch Enhanced Adhesion
Resist NR9-250P NR9-1000P NR9-1500P NR9-3000P NR9-6000P NR9-8000	Thickness 0.2µm - 0.6µm 0.7µm - 2.1µm 1.1µm - 3.1µm 2.1µm - 6.3µm 5.0µm - 12.2µm 6.0µm - 100.0µm
Temperature resistance = 100°C. NR9 series resists offer enhanced adhesion and are easily strippable at 25°C.

Applications
- Replacement for positive resists in RIE processing and wet etching
Properties
- Thickness range: <0.1 - 120.0 µm
- Sensitivity to wavelengths shorter than 380nm
Features
- superior linewidth control over surface topology
- straight sidewalls for any film thickness
- capability to apply 100 µm thick film in a single spin coating
- shorter bake time due to application of 150°C softbake (critical for thick films)
- superior photospeed, which enhances exposure throughput
- facilitates increased power density in RIE boosting etch rate and etch throughput
- elimination of use of adhesion promoters

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm².
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line