Planarizing Coatings

PC43 Coatings
Coating PC43-700 PC43-1500 PC43-6000	Thickness 0.6µm - 1.6µm 1.1µm - 3.2µm 5.0µm - 12.2µm

Applications
- Planarizing Layer
  - for use in etchback processes to transfer planar topology into an underlying dielectric
- Mechanical Protective Coating
  - for use in protecting vital components during sawing and dicing operations
- Temporary Gluing Layer
  - easily removable temporary adhesive layer for use in temporary bonding, back grinding or backside processing applications
Properties
- Superb planarizing capability
- Compatible with resist coaters
Impact on productivity
- Elimination of Chemical Mechanical Polishing (CMP) in some applicatios
- Suppression of microloading effects in etchback process
- Elimination of film peeling and cracking during dicing operations
- Easy removal in Resist Developer RD3 or RD6 after back grinding and wafer separation

Process flow for advanced planarization technique with resist patterning and etchback process.