• Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR26-12000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR26-12000P

  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line

  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
Photoresist Thickness = 3µm.

Planarizing Coatings

PC43 Coatings
0.6µm - 1.6µm
1.1µm - 3.2µm
5.0µm - 12.2µm

  • Applications
    • Planarizing Layer
      • for use in etchback processes to transfer planar topology into an underlying dielectric
    • Mechanical Protective Coating
      • for use in protecting vital components during sawing and dicing operations
    • Temporary Gluing Layer
      • easily removable temporary adhesive layer for use in temporary bonding, back grinding or backside processing applications
  • Properties
    • Superb planarizing capability
    • Compatible with resist coaters
  • Impact on productivity
    • Elimination of Chemical Mechanical Polishing (CMP) in some applicatios
    • Suppression of microloading effects in etchback process
    • Elimination of film peeling and cracking during dicing operations
    • Easy removal in Resist Developer RD3 or RD6 after back grinding and wafer separation

Process flow for advanced planarization technique with resist patterning and etchback process.