Negative Thick Resists

Thick Negative Resists – Subtractive or Additive Processing

Subtractive Processing & Molds
Resist NR5-8000	Thickness 5.8µm - 100.0µm
At processing temperatures < 120°C, NR5 series resists are strippable at 25°C.

Additive Processing
Resist NR26-12000P NR26-25000P	Thickness 10.0µm - 20.0µm 18.0µm - 200µm
Temperature resistance = 100°C. NR26 series resists offer enhanced adhesion and are easily strippable at 25°C.

Subtractive & Mold Applications
- Deep etching of silicon, such as Bosch Process, glass and polymers
- Embossing mold for silicone imprints
Additive Applications
- High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads
Properties for Subtractive & Mold Applications
- Superb temperature resistance in RIE processing and ion milling
- Selectivity superior to that of positive resists in deep etching
- Sensitivity to wavelengths shorter than 380nm
Properties for Additive Applications
- Superb adhesion during plating
- Easy removal with Futurrex resist strippers after plating
- Sensitivity to wavelengths shorter than 380nm
Impact on productivity
- Elimination of solvent-based development and solvent-based rinse processing steps
Features
- superb linewidth control over surface topology
- straight sidewalls for any film thickness
- capability to apply 100 μm thick film in a single spin coating
- superior resolution capability in thick film applications
- superior photospeed enhancing exposure throughput
- facilitates increased power density in RIE/ion milling, which boosts etch rate and etch throughput
- application of a single developer for both negative and positive resists
- elimination of use of adhesion promoters

Copper coil plated with NR26-12000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR26-12000P