• Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR4-8000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR4-8000P


  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line


  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.


Negative Thick Resists


Thick Negative Resists – Subtractive or Additive Processing
Subtractive Processing & Molds
Resist
NR5-8000
Thickness
5.8µm - 100.0µm
At precessing temperatures < 120°C, NR5 series resists are strippable at 25°C.
Additive Processing
Resist
NR4-8000P
NR21-20000P
Thickness
6.0µm - 20.0µm
18.0µm - 200µm
Temperature resistance = 100°C.
NR9 series resists offer enhanced adhesion and are easily strippable at 25°C.

  • Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads
  • Properties for Subtractive & Mold Applications
    • Superb temperature resistance in RIE processing and ion milling
    • Selectivity superior to that of positive resists in deep etching
    • Sensitivity to wavelengths shorter than 380nm
  • Properties for Additive Applications
    • Superb adhesion during plating
    • Easy removal with Futurrex resist strippers after plating
    • Sensitivity to wavelengths shorter than 380nm
  • Impact on productivity
    • Elimination of solvent-based development and solvent-based rinse processing steps
  • Features
    • superb linewidth control over surface topology
    • straight sidewalls for any film thickness
    • capability to apply 100 μm thick film in a single spin coating
    • superior resolution capability in thick film applications
    • superior photospeed enhancing exposure throughput
    • facilitates increased power density in RIE/ion milling, which boosts etch rate and etch throughput
    • application of a single developer for both negative and positive resists
    • elimination of use of adhesion promoters

Copper coil plated with NR4-8000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR4-8000P