• Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR4-8000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR4-8000P


  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line


  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.


Negative Lift-Off Resists


Negative Resists - Lift-off Applications
High Temperature Resists
Resist
NR7-1000PY
NR7-1500PY
NR7-3000PY
NR7-6000PY
Thickness
0.7µm - 2.1µm
1.1µm - 3.1µm
2.1µm - 6.3µm
5.0µm - 12.2µm
Temperature resistance = 180°C.
Degree of undercut is easily controlled by exposure dose for NR-PY type negative resists. At processing temperatures < 120°C, NR1 and NR7 series resists are strippable at 25°C.
Enhanced Adhesion
Resist
NR9-1000PY
NR9-1500PY
NR9-3000PY
NR9-6000PY
NR9-8000
Thickness
0.7µm - 2.1µm
1.1µm - 3.1µm
2.1µm - 6.3µm
5.0µm - 12.2µm
6.0µm - 25.0µm
Temperature resistance = 100°C.
NR9 series resists offer enhanced adhesion and are easily strippable at 25°C.

  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)
  • Properties
    • Formation of resist undercut during resist development
    • Thickness range: 0.7 - 25.0 µm
    • Easy adjustment of the degree of resist undercut as a function of exposure energy
    • Sensitivity to wavelengths shorter than 380nm
  • Impact on productivity
    • Elimination of dry etching process in patterning metals and dielectrics
    • Elimination of the need for bilayer resists

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.