Negative Lift-Off Resists

Negative Resists - Lift-off Applications

High Temperature Resists
Resist NR77-1000PY NR77-1500PY NR77-3000PY NR77-6000PY	Thickness 0.7µm - 2.1µm 1.1µm - 3.1µm 2.1µm - 6.3µm 5.0µm - 12.2µm
Temperature resistance = 180°C. Degree of undercut is easily controlled by exposure dose for NR-PY type negative resists. At processing temperatures < 120°C, NR1 and NR7 series resists are strippable at 25°C.

Enhanced Adhesion
Resist NR9-1000PY NR9-1500PY NR9-3000PY NR9-6000PY NR9-8000	Thickness 0.7µm - 2.1µm 1.1µm - 3.1µm 2.1µm - 6.3µm 5.0µm - 12.2µm 6.0µm - 25.0µm
Temperature resistance = 100°C. NR9 series resists offer enhanced adhesion and are easily strippable at 25°C.

Applications
- Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
- Permanent components of devices (i.e. spacers, etc.)
Properties
- Formation of resist undercut during resist development
- Thickness range: 0.7 - 25.0 µm
- Easy adjustment of the degree of resist undercut as a function of exposure energy
- Sensitivity to wavelengths shorter than 380nm
Impact on productivity
- Elimination of dry etching process in patterning metals and dielectrics
- Elimination of the need for bilayer resists

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.