• Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR26-12000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR26-12000P

  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line

  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
Photoresist Thickness = 3µm.


One of Futurrex’s core markets for the past decade has been the MEMS market, which has grown both in the number of products that are created using microfabrication technologies and the number of sockets such device’s can play into. Futurrex has extraordinary products with novel physical characteristics allowing OEMs to create end products that break the mold with respect to differentiation and performance.

With Futurrex solutions, device designers can quickly prototype their ideas and manufacture devices with extraordinary aspect ratios, in excess of 6:1 at thicknesses of 120 μm or higher, while ensuring quick and full development out of trenches or unique geometries. Lastly all of our products are readily removable or strippable or can be left as permanent parts of any structure.

Such products and associated processing techniques yield uniquely-performing devices at high yield.

We have experience in providing products for a variety of applications spanning semiconductor testing devices to inductive coils and RF-related structures that have evolved from more mature and commoditized technologies.

The following is a list of product suites that Futurrex has that can enable a customer to meet their device demands:

  • NR9-P-series for trench filling applications and the creation of air bridges over deep trenches thus enabling ideal dielectric conditions
  • NR5/NR7-series for deep etching for thicknesses ranging from 10-100+ μm, on a variety of exotic substrates and high energy RIE
  • NR26-series for plating, wet etching and advanced adhesion applications with greater than 120μm thickness capability that is readily strippable at aspect ratios greater than 6:1
  • NR7/NR9-PY-series resists for lift-off applications
  • PC4-series for use as temporary adhesive coatings, planarizing coatings and mechanical protective layers
  • IC1-series for use in high-temperature lift-off applications, protective and smoothing coating applications