• Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR26-12000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR26-12000P

  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line

  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
Photoresist Thickness = 3µm.


In 1985 Futurrex launched its first product lines including high-performance positive resists and its core library of negative resists that were geared to replace conventional positive resists for g, h and i-line microfabrication.

For the past two decades since its inception Futurrex has expanded product categories and has continued to develop core product suites that have successfully differentiated themselves with respect to performance, process efficacy and cost per device to the benefit of end customers in various markets. Core product categories include:

Futurrex also provides customers with custom solutions that enable them to meet requisite performance metrics where conventional solutions are not applicable.

Inquire within to see what turn-key solutions Futurrex can provide you.