• Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR4-8000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR4-8000P


  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line


  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.


Negative Photoresists



Negative Photoresists Developable in a Basic Water Developer:
Negative Etch Resists
Thickness Range: 0.5 - 200 micrometers
Performance:
  • No HMDS or adhesion promoters necessary
  • Superior resolution capability.
  • Short exposure time.
  • Short development time.
  • Superior temperature resistance of up to 180 degrees Celsius.
  • Superior selectivity in RIE process.
  • Easy resist removal in Resist Remover RR41.
  • Shelf life exceeding 3 years in storage at room temperature.
Applications:
  • High-selectivity reactive ion etching.
  • Process steps where high temperature resistance is required, e.g. ion implantation.
Thick Resists
Thickness Range: 8 - 200 micrometers
Performance:
  • Superior resolution capability.
  • Short bake time.
  • High photo speed which translates into high exposure throughput.
  • Short development time.
  • Superior adhesion.
  • Easy resist removal in Resist Remover RR41.
  • Shelf life exceeding 3 years in storage at room temperature.
Applications:
  • Metal plating for the fabrication of:
    • bumps for flip-chip packaging
    • mutli-chip modules
    • MEMS
    • sensors
    • thin-film magnetic heads
  • deep trench planarization
Resists with Sidewall Undercut for Lift-off Process
Thickness Range: 0.5 - 40 micrometers
Performance:
  • Superior resolution capability.
  • Short bake time.
  • Easy adjustment of the degree of resist undercut as a function of exposure energy.
  • Short development time.
  • Superior temperature resistance of up to 200 degrees Celsius.
  • Superior selectivity in RIE process.
  • Easy resist removal in Resist Remover RR41.
  • Shelf life exceeding 3 years in storage at room temperature.
Applications:
  • Lift-off process in fabrication of:
    • laser diodes
    • GaAs integrated circuits
    • ferro- electric RAMs
    • flat-panel displays
    • MEMS
    • sensors
    • biochips