Subtractive & Mold Applications
- Deep etching of silicon, such as Bosch Process, glass and polymers
- Embossing mold for silicone imprints
Additive Applications
- High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR26-12000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR26-12000P

Applications
- Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm².
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line

Applications
- Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
- Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.

Spin-On Dopants

Spin-On Dopant Coatings
Coating BDC1-2000 PDC1-2000 ZDPC2-2000	Type Boron Dopant Coating Phosphorus Dopant Coating Zinc Dopant Coating

Applications
- Spin-on boron source [a-Si, c-Si applications]
- Spin-on phosphorus source [a-Si, c-Si applications]
- Spin-on zinc source [III/V substrates]
Properties
- Transparent film converted to solid-state dopant upon application of oxygen plasma
Impact on productivity
- Elimination of doped spin-on glasses
- Elimination of ion implantation in some applications
- Elimination of zinc doping from ampoule