Positive Photoresists
| Positive Photoresists |
Resist
PR1-1000A1
PR1-2000A1
PR1-4000A1
PR1-12000A1
|
Thickness
0.7μm - 2.1μm
1.4μm - 4.2μm
2.8μm - 15.0μm
11.8μm - 24.5μm
|
| Temperature resistance < 130°C |
- Applications
- Enhanced adhesion positive resists for dry/wet etching, plating or ion implant.
Typical profile for Futurrex Positive Resist PR1-4000A1
Thickness = 10μm
| Positive Photoresists Developable in a Basic Water Developer: |
| General Purpose Resists |
| Thickness Range: |
0.7 - 3 micrometers |
| Performance: |
- No HMDS or adhesion promoters necessary
- Effective suppression of reflective notching
- Elimination of sensitizer sublimation, which prevents clogging in bake exhaust lines
- Superior resolution capability.
- Short exposure time.
- Short developmenttime.
- Superior temperature resistance.
- Easy resist removal in Resist Remover RR4.
- Shelf life exceeding 1 year in storage at room temperature.
|
| Applications: |
- Etching, ion implantation, metal plating in fabrication of:
- integrated circuits
- MEMS
- flat panel displays
- high density packaging
|
| Thick Resists |
| Thickness Range: |
3 - 25 micrometers |
| Performance: |
- Superior resolution capability.
- Fast photo speed translates into high exposure throughput.
- Short development time.
- Superior selectivity in RIE process.
- Easy resist removal in Resist Remover RR4.
- Shelf life exceeding 1 year in storage at room temperature.
|
| Applications: |
- Metal plating, ion implantation in fabrication of
- integrated circuits
- MEMS
- flat panel displays
- high density packaging
|
