• Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR4-8000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR4-8000P


  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line


  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.


Positive Photoresists


Positive Photoresists
Resist
PR1-1000A
PR1-2000A
PR1-4000A
PR1-12000A
Thickness
0.7μm - 2.1μm
1.4μm - 4.2μm
2.8μm - 15.0μm
11.8μm - 24.5μm
Temperature resistance < 130°C

  • Applications
    • Enhanced adhesion positive resists for dry/wet etching, plating or ion implant.

Typical profile for Futurrex Positive Resist PR1-4000A
Thickness = 10μm


Positive Photoresists Developable in a Basic Water Developer:
General Purpose Resists
Thickness Range: 0.7 - 3 micrometers
Performance:
  • No HMDS or adhesion promoters necessary
  • Effective suppression of reflective notching
  • Elimination of sensitizer sublimation, which prevents clogging in bake exhaust lines
  • Superior resolution capability.
  • Short exposure time.
  • Short developmenttime.
  • Superior temperature resistance.
  • Easy resist removal in Resist Remover RR4.
  • Shelf life exceeding 1 year in storage at room temperature.
Applications:
  • Etching, ion implantation, metal plating in fabrication of:
    • integrated circuits
    • MEMS
    • flat panel displays
    • high density packaging

Thick Resists
Thickness Range: 3 - 25 micrometers
Performance:
  • Superior resolution capability.
  • Fast photo speed translates into high exposure throughput.
  • Short development time.
  • Superior selectivity in RIE process.
  • Easy resist removal in Resist Remover RR4.
  • Shelf life exceeding 1 year in storage at room temperature.
Applications:
  • Metal plating, ion implantation in fabrication of
    • integrated circuits
    • MEMS
    • flat panel displays
    • high density packaging