• Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR26-12000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR26-12000P

  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line

  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
Photoresist Thickness = 3µm.

Resist Removers

Resist Removers
Aqueous, Basic Solution
Ester-based Solution
DMSO-based Solution

  • Applications
    • Removal of resist pattern after processing is complete
  • Properties
    • Liquid
  • Impact on productivity
    • Reduction of time to remove resist
    • Meet all REACH & international environmental standards

Solvent-based resist removers:
Applications: Solvent-based resist removers are compatible with metals and oxides applied in electronic and opto-electronic device fabrication.  Solvents utilized in resist remover formulations present low hazard in industrial applications.

Water-based resist removers:
Applications: Water based resist removers are compatible with gold, platinum and copper.