• Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR4-8000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR4-8000P


  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line


  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.


Adhesion, Protection, Planarization

Futurrex provides a variety of specialty chemicals that can be used for niche processing applications. These specialty coatings can act as easily removable adhesives used for temporary bonding in backside processing, mechanical protective coatings during cutting, dicing or chemical mechanical polishing (CMP) and planarizing coatings for etchback purposes. All Futurrex specialty coatings falling into this category can easily be removed with Futurrex resist developers or removers.

  • PC3-series coatings for planarization, temporary adhesion and mechanical protective applications.
  • RD6 series specialty coating remover under special process conditions.
  • RR41 & 5 series chemicals for efficient and unique performance during specialty coating removal, while being compatible with Si, III/V substrates, II/VI substrates, Indium Tin Oxide (ITO) and all conventional metals including Cu, Ti, TiW, Au, Pt, Al, Ni, Ag-alloys, etc.