• Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR4-8000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR4-8000P


  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line


  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.


Spin-On Glass Coatings


Spin-On glass
Coating
IC1-200
DC4-500
Thickness
0.17µm - 0.50µm
0.45µm - 1.0µm

  • Applications
    • Smoothing layer as a part of dielectric in multilevel metal process
    • Protective coating
    • Intermediate coating in trilayer resist process
  • Properties
    • Compatible with spin coating techniques
    • Shelf-life exceeding 3 years at room temperature
    • Good adhesion to polymers
    • Lack of solubility in common solvents after curing at temperatures lower than 100°C
    • Compatible with typical resist coating equipment and no need for SOG coaters
  • Impact on productivity
    • Elimination of CVD SiO2 in some applications
    • Elimination of time consuming deposition and etchback of SiO2 to fill narrow tranches in multilevel metal process
    • Elimination of polishing in preparation of substrates for thin film magnetic head fabrication