Negative Resists Positive Resits
Edge Bead Removers Resist Developers
Resist Removers Planarizing Coatings
Spin-on Glases Spin-on Dopants

 
   Positive Resists
 



 

 
 
 

 

 

 

 
 


 

Positive Photoresists Developable in a Basic Water Developer:

General Purpose Resists
Thickness Range: 0.7 - 3 micrometers
Performance:
  • Superior resolution capability.
  • Short exposure time.
  • Short development time.
  • Superior temperature resistance.
  • Easy resist removal in Resist Remover RR4.
  • Shelf life exceeding 1 year in storage at room temperature.
Applications:
  • Etching, ion implantation, metal plating in fabrication of:
    integrated circuits
    MEMS
    flat panel displays
    high density packaging

 

Thick Resists
Thickness Range: 3 - 25 micrometers
Performance:
  • Superior resolution capability.
  • Fast photo speed translates into high exposure throughput.
  • Short development time.
  • Superior selectivity in RIE process.
  • Easy resist removal in Resist Remover RR4.
  • Shelf life exceeding 1 year in storage at room temperature.
Applications:
  • Metal plating, ion implantation in fabrication of
    integrated circuits
    MEMS
    flat panel displays
    high density packaging

 

 

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Futurrex, Inc.,  12 Cork Hill Road, Franklin, NJ 07416, USA
Phone: 973-209-1563   |  Fax: 973-209-1567

 

Email: info@futurrex.com 
 

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