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Negative Resists

General Purpose | Special Application | Thick Film | Sidewall Undercut

Negative Photoresists Developable in a Basic Water Developer:
General Purpose Resists
Thickness Range:	0.5 - 8 micrometers
Performance:	Superior resolution capability. Short bake time. Short exposure time. Short development time. Superior adhesion. Easy resist removal in Resist Remover RR4. Shelf life exceeding 3 years in storage at room temperature.
Applications:	Replacement for polyisoprene-bisazide based negative photoresists. Fabrication of integrated circuits.

Special Application Resists
Thickness Range:	0.5 - 120 micrometers
Performance:	Superior resolution capability. Short exposure time. Short development time. Superior temperature resistance of up to 180 degrees Celsius. Superior selectivity in RIE process. Easy resist removal in Resist Remover RR4. Shelf life exceeding 3 years in storage at room temperature.
Applications:	High-selectivity reactive ion etching. Process steps where high temperature resistance is required, e.g. ion implantation.

Thick Resists

Thickness Range:

8 - 120 micrometers

Performance:

Applications:

Metal plating in fabrication of:

	bumps for flip-chip packaging
	mutli-chip modules
	MEMS
	sensors
	thin-film magnetic heads

Thickness Range:

0.5 - 40 micrometers

Performance:

Superior resolution capability.
Short bake time.
Easy adjustment of the degree of resist undercut as a function of exposure energy.
Short development time.
Superior temperature resistance of up to 200 degrees Celsius.
Superior selectivity in RIE process.
Easy resist removal in Resist Remover RR4.
Shelf life exceeding 3 years in storage at room temperature.

Applications:

Lift-off process in fabrication of:

Resist Profile:

Futurrex, Inc., 12 Cork Hill Road, Franklin, NJ 07416, USA
Phone: 973-209-1563 | Fax: 973-209-1567

Email: info@futurrex.com