• Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR4-8000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR4-8000P


  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line


  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.


Contact

Select a Region:

Contact Futurrex Inc.

At Futurrex Inc. we believe that providing exceptional customer service is just as important as producing superior technology. How can we help you today? Please submit your message below and we'll get back to you within 2 business days.

Futurrex, Inc.

Corporate Headquarters
24 Munsonhurst Road
Franklin, NJ 07416
USA

Tel: 888-999-4188
Billing, Shipping & Logistics: 973-209-1563
Fax: 973-209-1567
info@futurrex.com

First Name

Last Name

Email

Subject

Message

Yes, I accept Terms of Use Agreement