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  • Subtractive & Mold Applications
    • Deep etching of silicon, such as Bosch Process, glass and polymers
    • Embossing mold for silicone imprints
  • Additive Applications
    • High aspect ratio plating for the fabrication of bumps for flip-chip packaging, multi-chip modules, MEMS, sensors, thin-film magnetic heads

Copper coil plated with NR26-12000P mask after resist removal.
Metal (Cu) Thickness = 25µm
Photoresist = Futurrex NR26-12000P


  • Applications
    • Replacement for positive resists in RIE process and general etch applications

Futurrex NR5-8000, 4.5:1 AR
Example of resist resolution
Film thickness: 54µm
Mask dimension: 12µm line/space
Exposure dose: 1100 mJ/cm2.
Focus offset: -15µm.
Exposure tool: Ultratech Stepper Saturn
Model, i-line


  • Applications
    • Facilitation of single-layer lift-off process to pattern metals and dielectrics without RIE
    • Permanent components of devices (i.e. spacers, etc.)

Futurrex NR1-3000PY
Liftoff profile for Negative Resist
NR1-3000PY.
Photoresist Thickness = 3µm.


Packaging

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In the realm of back-end-of-the-line processing, Futurrex has several product categories that enhance the capabilities of packaging fabs.
The following are applied to bumping, flip-chip packaging, 3D stacking and through-silicon via (TSV) solutions:

  • NR26-P series negative resists for bumping and extreme thickness applications of greater than 100μm where superb resolution and easy removal are required.
  • NR5-series negative resists for thick film masking applications in deep reactive ion etching (RIE) and through-silicon via (TSV) applications
  • PR1-series positive-tone resists for bumping, general patterning and etch applications
  • RD6 series resist developer for quick resist development, universally compatible with the development of positive or negative resists.
  • RR41/RR5 series chemicals for efficient and unique characteristics and performance during resist removal, including the safe removal of various temporary coatings, while being 100% compatible with Si, III/V substrates, II/VI substrates, Indium Tin Oxide (ITO) and all conventional metals including Cu, Ti, TiW, Au, Pt, Al, Ni, Ag-alloys, etc.
  • EBR2 series solutions for efficient and quick edge bead removing applications
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